Rambus Announces Silicon-proven R+ DDR4 PHY on GLOBALFOUNDRIES 14nm LPP Process for Networking and Data Center Applications
July 26 2016 - 4:30PM
Business Wire
Production-ready PHY IP will address the
high-performance needs of enterprise systems
Rambus Inc. (NASDAQ:RMBS) today announced that it has
developed an R+ DDR4 PHY on the GLOBALFOUNDRIES FX-14™ ASIC
platform using the company’s most advanced 14nm Power Plus (LPP)
process. As part of a comprehensive suite of memory and SerDes
interface offerings for networking and data center applications,
Rambus has achieved the first production-ready 3200 Mbps DDR4 PHY
available on GLOBALFOUNDRIES power-performance optimized 14nm LPP
process. The R+ DDR4 PHY is designed to meet the performance and
capacity demands of the next wave of data center and networking
markets.
“As we become more reliant on the cloud and the stresses placed
on data centers continues to grow, the need for memory offerings
that promise faster speeds and higher bandwidth has never been more
important,” said Luc Seraphin, senior vice president and general
manager of the Rambus Memory and Interfaces division. “Together
with GLOBALFOUNDRIES, we have been able to develop the industry’s
first DDR4 PHY on a 14nm LPP process running at 3200 Mbps and
capable of achieving the performance requirements of
next-generation systems.”
“GLOBALFOUNDRIES’ FX-14™ platform, based on our advanced 14nm
LPP technology, is designed to support the memory intensive
computing tasks in today’s most demanding enterprise applications,”
said Kevin O’Buckley, vice president product development
GLOBALFOUNDRIES. “At 3200 Mbps, the R+ DDR4/3 PHY delivers the
maximum data rate supported by the standard enabling advanced
functionality like simultaneous streaming of Ultra HD content. We
look forward to continue collaborating with Rambus as we develop a
fully-featured suite of memory products designed to ensure the best
performance for today’s data centers.”
The Rambus R+ DDR4 PHY is DFI 4.0 compatible, providing easy
integration, and enables customers to differentiate their offerings
by providing industry-leading performance while maintaining full
compatibility with industry standard DDR4, and DDR3/3L/3U
interfaces. Designed for flexibility, the R+ DDR4 PHY delivers data
rates from 800 to 3200 Mbps in multiple memory sub-system options
including die down, DIMM, and 3DS. In addition, the PHY supports 16
– 72-bit interfaces, along with single and multi-rank
configurations, allowing the end customer to optimize their design
for performance, as well as both area and low power.
For more information on R+ DDR4 and our other memory PHYs, visit
rambus.com/ddrnphys.
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About Rambus Memory and Interfaces Division (MID)
The Rambus Memory and Interfaces Division develops products and
services that solve the power, performance, and capacity challenges
of the mobile, connected device, and cloud computing markets.
Rambus enhanced standards-compatible and custom memory and serial
link solutions include chips, architectures, memory and
chip-to-chip interfaces, DRAM, IP validation tools, and system and
IC design services. Developed through our system-aware design
methodology, Rambus products deliver improved time-to-market and
first-time-right quality.
About Rambus Inc.
Rambus creates cutting-edge semiconductor and IP products,
spanning memory and interfaces to security, smart sensors and
lighting. Our chips, customizable IP cores, architecture licenses,
software, tools, services, training and innovations improve the
competitive advantage of our customers. We collaborate with the
industry, partnering with leading ASIC and SoC designers,
foundries, IP developers, EDA companies and validation labs. Our
products are integrated into tens of billions of devices and
systems, powering and securing diverse applications, including Big
Data, Internet of Things (IoT), mobile, consumer and media
platforms. At Rambus, we are makers of better. For more
information, visit rambus.com.
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From Racepoint GlobalHilary Costa,
415-694-6705hcosta@racepointglobal.com
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