SAN JOSE, Calif. and
SANTA CLARA, Calif., June 22, 2015 /PRNewswire/ -- Cadence Design
Systems, Inc. (NASDAQ: CDNS) and Applied Materials, Inc. (NASDAQ:
AMAT) today announced the companies are collaborating on a
development program to optimize the chemical-mechanical
planarization (CMP) process through silicon characterization and
modeling for advanced-node designs at 14 nanometer (nm) and below.
The program allows design teams to predict the impact of CMP on
both functional yield and parametric yield, and for manufacturing
teams to boost planarization performance, which is increasingly
critical for advanced FinFET architectures.
The Cadence® and Applied Materials joint development
program is focused on front end-of-line (FEOL) and wafer-level CMP
modeling. Applied Materials can use the Cadence CMP Process
Optimizer, a tool that allows silicon calibration of semi-physical
models and optimization of CMP material and process parameters such
as pressure, polish time and overall CMP uniformity, to enhance the
precision performance of its Reflexion® LK Prime™ CMP
system.
Once models are calibrated, design teams can leverage Cadence
CMP Predictor, a tool that enhances design performance and yield
through model-based CMP hotspot detection and CMP-aware RC
extraction. It provides full-chip, multi-level CMP thickness and
topography predictions for shallow trench isolation (STI) and
replacement metal gate (RMG) CMP processes. For more information on
Cadence CMP Predictor and Cadence CMP Process Optimizer, please
visit www.cadence.com/news/cmp.
Applied Materials is an industry leader in precision CMP
technology with its Reflexion LK Prime CMP system that offers
high-speed planarization and multi-zone polishing heads to enable
superior uniformity and efficiency with low downforce for
extendibility to <14nm device generations. The Reflexion LK
Prime CMP system also implements a full suite of advanced process
control capabilities that ensure excellent within-wafer and
wafer-to-wafer process uniformity control and repeatability for all
planarization applications.
"Working together with Cadence, we're driving advances in CMP
process performance," said Derek
Witty, vice president and general manager of the CMP
Products Group at Applied Materials. "From our collaboration, we
expect to more accurately predict gate height, dishing and erosion
on each step of the CMP process, which could enable design and
manufacturing teams to achieve higher yield and deliver
advanced-node designs to market faster."
"Cadence CMP Predictor helps turn the uncertainty of
manufacturing process variation into predictable impacts, and then
minimizes these impacts during the design stage," said Dr.
Anirudh Devgan, senior vice
president and general manager of the Digital and Signoff Group at
Cadence. "The joint development program with Applied Materials can
allow us to drive advancements in CMP modeling processes so our
design and manufacturing customers can maximize design yield and
performance."
About Cadence
Cadence enables global electronic design innovation and plays an
essential role in the creation of today's integrated circuits and
electronics. Customers use Cadence software, hardware, IP and
services to design and verify advanced semiconductors, consumer
electronics, networking and telecommunications equipment, and
computer systems. The company is headquartered in San Jose, Calif., with sales offices, design
centers and research facilities around the world to serve the
global electronics industry. More information about the company,
its products and its services is available at www.cadence.com.
About Applied Materials
Applied Materials, Inc. (NASDAQ: AMAT) is the global leader in
materials engineering solutions for the semiconductor, flat panel
display and solar photovoltaic industries. Our technologies help
make innovations like smartphones, flat screen TVs and solar panels
more affordable and accessible to consumers and businesses around
the world. Learn more at http://www.appliedmaterials.com/.
© 2015 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence and the Cadence logo are registered trademarks
of Cadence Design Systems, Inc. in the
United States and other countries. All rights
reserved. All other trademarks are the property of their
respective owners.
Applied Materials, Reflexion and the Applied Materials logo
are registered trademarks and LK Prime is a trademark of Applied
Materials, Inc. in the United
States and other countries. All rights
reserved.
This press release contains certain forward-looking
statements, including expectations for technology and product
development timelines, availability, and performance that are based
on our current expectations and involve numerous risks and
uncertainties that may cause these forward-looking statements to be
inaccurate. Risks that may cause these forward-looking statements
to be inaccurate include among others: our development plans may be
delayed or altered, our collaboration with partners may change, or
the other risks detailed from time-to-time in our Securities and
Exchange Commission filings and reports, including, but not limited
to, our most recent quarterly report on Form 10-Q. We do not intend
to update the information contained in this news release.
Applied Materials Media Relations
408-563-6209
connie_duncan@amat.com
Cadence Newsroom
408-944-7039
newsroom@cadence.com
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SOURCE Cadence Design Systems, Inc.