Rambus Engineers and Scientists to Present New Research and Demonstrations at DesignCon 2015
January 28 2015 - 12:07PM
Business Wire
Rambus Inc. (NASDAQ:RMBS):
Who: Rambus Inc. (NASDAQ:RMBS)
Where: DesignCon 2015 Santa Clara Convention Center – Booth
#835 5001 Great America Parkway, Santa Clara, Calif.
DesignCon.com
When: January 27 - 30, 2015
At DesignCon 2015, Rambus engineers and scientists will present
four papers on the latest research in ultra-high speed interface
design as well as showcase a wide range of silicon-proven R+™
enhanced standard memory and serial link core solutions at the
Rambus booth (#835). In addition, Rambus will be demonstrating the
recently announced On-chip Noise Monitor.
Rambus engineers will also be hosting a full-day training
workshop on January 28, covering key trends and challenges that are
driving system and silicon architectures today and in the near
future.
Click to Tweet: @rambusinc will be exhibiting,
speaking and training at @UBMDesignCon 2015 on 1/27-30
#Innovation #Designcon
Paper Presentations:
Title: “Modeling and Analysis of Differential vs.
Single-Ended Signaling with Through-Silicon VIAS (TSVS) for
Low-Power/High-Speed 3D IC Channel Design”Rambus
Speakers/Authors: Joohee Kim, Hai Lan, Wendem
BeyeneDate: Wednesday, January 28Time: 8:30 a.m.-9:10
a.m.Link
Title: “Design and Characterization of Interconnects for
Serial Links Operating at 56 Gbps and Beyond”Rambus
Speakers/Authors: Wendem Beyene, Yeon-Chang Hahm, Dave Secker,
Don Mullen, Narayanan MayandiDate: Wednesday, January
28Time: 9:20 a.m.-10:00 a.m.Link
Title: “Design and Simulation of Equalizer Adaptation
Engine in Multi-Protocol Serial Links”Rambus
Speakers/Authors: Arash Zargaran Yazd, Wendem Beyene, Roxanne
Vu, Nikhil Vaidya, Simon LiDate: Wednesday, January 28,
2014Time: 10:15 a.m.-10:55 a.m.Link
Title: “Design and Characterization of a Low-Power, 6.4
Gbps Data Rate DDR Memory Interface System”Rambus
Speakers/Authors: Ravi Kollipara, Pravin K. Venkatesan,
Ganapathy E. Kumar, Scott Best, Liji Gopalakrishnan, Chris Madden,
Lei Luo, Michael Bucher, Hai Lan, Kashinath PrabhuDate:
Wednesday, January 28, 2014Time: 10:15 a.m.-10:55
a.m.Link
Follow RambusCompany website: rambus.comRambus blog:
rambusblog.comTwitter: @rambusincLinkedIn:
linkedin.com/company/rambusFacebook: facebook.com/RambusInc
About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores,
architecture licenses, tools, services, and training improve the
competitive advantage of our customer’s products while accelerating
their time-to-market. Rambus products and innovations capture,
secure and move data. For more information, visit rambus.com.
Press contacts:MSLGROUPSam Katzen,
415-512-0770rambus@mslgroup.com
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