Rambus & Mobiveil Partner to Bring Pre-Validated Solution to Chip Makers, Delivering Memory Flexibility & Accelerated Time-to...
November 18 2014 - 04:30PM
Business Wire
Certified interoperability of DDR4/3, LPDDR3/2
Multi-modal PHY and Universal controller combines industry-leading
signal integrity and broad configurability
Rambus Inc. (NASDAQ:RMBS) and Mobiveil today announced they have
validated interoperability of the Rambus R+™ DDR4 Multi-modal PHY
with the Mobiveil Universal Multiport Memory Controller (UMMC) Core
for JEDEC standard DDR4/3 and LPDDR3/2 operation. As part of the
overall Rambus IP Cores program, the integrated IP provides
chipmakers with a pre-validated, industry standard solution that
reduces costs and risk by reducing IP qualification time. In
addition, the differentiated memory subsystem brings together the
superior signal integrity and low power offered by the Rambus R+
multi-modal PHY with the flexibility of the Mobiveil UMMC in a
single, easily integrated solution.
“Partnering with Mobiveil to bring a complete offering to market
demonstrates both companies’ commitment to meeting customer needs
in the face of increasingly complex and costly SoC development,”
said Kevin Donnelly, general manager of the Memory and Interface
division at Rambus. “By working in a collaborative manner with
companies like Mobiveil, we are addressing chip makers needs with
proven and ready-to-use IP blocks that minimize qualification and
integration time.”
“Our UMMC Controller Core has successfully proven to be both
flexible and configurable for real-time consumer applications,”
said Ravi Thummarukudy, chief executive officer of Mobiveil.
“Pairing our technology with the Rambus R+ multi-modal PHY provides
customers with the best DRAM solution for their particular
application without changing the SoC, which substantially minimizes
design time and development cycles across a broad number of
applications.”
The Rambus R+ DDR4/3, LPDDR3/2 multi-modal PHY delivers
industry-leading performance while providing SoC makers a
comprehensive array of memory choices, ranging from
high-performance to low-power applications. To complement its broad
applicability, the R+ DDR4/3 multi-modal PHY delivers versatile
configuration options for both area- and power-optimized consumer
applications and performance-intensive compute applications.
Additionally, the enhanced standards IP cores are designed with
system-aware methodology to ensure superior signal integrity and
system margin for optimal DRAM vendor interoperability. The PHY is
available in several low-power foundry processes and can be
configured for both flip-chip and wire bond packages with data
rates ranging from 800 to 3200 Mbps.
Mobiveil's UMMC Controller is a highly flexible and configurable
design. It is targeted for high bandwidth access and low power
consumption such as next-generation mobile, networking and consumer
applications. The controller architecture is carefully tailored to
achieve reliable high-frequency operation with dynamic power
management and rapid system debug capabilities. Its flexible AXI
System interface makes it easy to be integrated into a wide range
of applications.
Mobiveil has joined the Rambus Partner Program, which will
enable further collaboration on other combined IP blocks offerings
between the two companies. For additional information on the Rambus
Partner Program, visit rambus.com/partners.
Follow Rambus
Company website: rambus.comRambus blog: rambusblog.comTwitter:
@rambusincLinkedIn: www.linkedin.com/company/rambusFacebook:
www.facebook.com/RambusInc
About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores,
architecture licenses, tools, services, and training improve the
competitive advantage of our customer’s products while accelerating
their time-to-market. Rambus products and innovations capture,
secure and move data. For more information, visit rambus.com.
About Mobiveil, Inc.
Mobiveil is a fast‐growing technology company that specializes
in development of Silicon Intellectual Properties, platforms and
solutions for the storage, networking and enterprise markets.
Mobiveil team leverages decades of experience in delivering
high‐quality, production‐proven, highspeed serial interconnect
Silicon IP cores and custom and standard form factor hardware
boards to leading customers worldwide.. Mobiveil is headquartered
in the Silicon Valley with engineering development centers located
in Milpitas, CA, Chennai and Bangalore, India, and sales offices
and representatives located in US, Europe, Israel, Japan, Taiwan
and People Republic of China. For more information, please visit
http://www.mobiveil.com
For RambusMSLGROUPSam Katzen,
415-512-0770rambus@mslgroup.comorFor MobiveilMobiveil,
Inc.Jonah McLeod, 510-449-8634Jonah@mobiveil.com
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