Vicor Pushes Power Density Boundaries and Introduces Digital Communication Capability With New ChiP Bus Converter Modules
April 15 2014 - 9:00AM
Marketwired
Vicor Pushes Power Density Boundaries and Introduces Digital
Communication Capability With New ChiP Bus Converter Modules
New ChiP-Based BCMs Provide Breakthrough Power Density of 2750
W/in3, Supplying up to 1.75 kW With 98% Peak Efficiency
ANDOVER, MA--(Marketwired - Apr 15, 2014) - Vicor
Corporation (NASDAQ: VICR) today announced the newest entries in
its portfolio of isolated bus converter modules (BCMs®) based on
the company's award-winning Converter housed in Package (ChiP)
power component platform. Supplying up to 1.75 kW at 50 V with 98%
peak efficiency and power density of 2750 W/in3, Vicor's new ChiP
BCM fixed-ratio power converters deliver 5X the power density of
competing solutions, further extending the company's power
performance leadership in this product category.
Vicor has also introduced new digital telemetry and control
capabilities for its ChiP BCM portfolio, available as an option for
the new 1.75 kW modules and previously announced 1.2 kW modules.
This PMBus™ compliant digital interface option gives system
designers access to the ChiP BCM's internal controller, enabling
digital communication with an array of ChiP BCMs via a single bus
for control, configuration, monitoring and other telemetry
functions.
Vicor's ChiP BCMs' power performance profile is made possible by
the underlying ZCS/ZVS Sine Amplitude Converter™ topology.
Operating at megahertz switching frequency, ChiP BCMs enable fast
response time and low noise operation at industry leading
efficiencies. High fixed frequency operation also simplifies and
reduces the size of external filter designs, yielding additional
cost savings and accelerating time to market.
The new ETSI and ITU compliant 1.75 kW modules support a nominal
input voltage of 400 V and nominal output voltage of 50 V, with a
K-factor of 1/8. Vicor's 1.2 kW and new 1.75 kW BCMs are offered in
the 6123 package. Standard BCM features include bidirectional
operation, under-over-voltage lockout, over-current, short circuit
and over-temperature protection.
"With the introduction of our newest ChiP BCMs, we've again
raised the bar for bus converter power density while introducing
new digital communication functionality for customers seeking
flexible control and monitoring capabilities," said Stephen Oliver,
VP of VI Chip product line, Vicor. "These features extend the value
and versatility of the ChiP BCM product family, enabling power
engineers to achieve new levels of system power performance for
high voltage DC distribution in datacenter, telecom and industrial
applications."
Converter housed in Package (ChiP) Platform Vicor's ChiP
platform sets best-in-class standards for a new generation of
scalable power modules. Leveraging advanced magnetic structures
integrated within high density interconnect (HDI) substrates with
power semiconductors and control ASICs, ChiP-based power modules
provide superior thermal management supporting unprecedented power
density. Thermally adept ChiP-based modules enable customers to
achieve low cost power systems with previously unattainable system
size, weight and efficiency attributes, quickly and predictably.
The ChiP platform embodies a modular power system design
methodology that enables designers to achieve high-performance,
cost-effective power systems from AC or DC sources to the Point of
Load using proven building blocks.
Pricing and Availability Vicor's 1.75 kW ChiP BCMs and 1.2 kW
ChiP BCMs are available today -- pricing for OEM quantities is
$170.00 and $120.00 respectively. The digital telemetry and control
options are priced separately. Visit the website for more
information. To order, email custserv@vicorpower.com or call
1-800-735-6200.
Follow Vicor on Social Media Twitter: @VicorPower Vicor
Corporation on LinkedIn Vicor PowerBlog
About Vicor Corporation Headquartered in Andover, Massachusetts,
Vicor Corporation designs, manufactures and markets innovative,
high-performance modular power components, from bricks to
semiconductor-centric solutions, to enable customers to efficiently
convert and manage power from the wall plug to the point of load.
Complementing an extensive portfolio of patented innovations in
power conversion and power distribution with significant
application development expertise, Vicor offers comprehensive
product lines addressing a broad range of power conversion and
management requirements across all power distribution
architectures, including CPA, DPA, IBA, FPA™ and CBA. Vicor focuses
on solutions for performance-critical applications in the following
markets: enterprise and high performance computing,
telecommunications and network infrastructure, industrial equipment
and automation, vehicles and transportation and aerospace and
defense electronics. www.vicorpower.com
Vicor, BCM, Sine Amplitude Converter, VI Chip and FPA are
trademarks of Vicor Corporation. The PMBus name and logo are
trademarks of SMIF, Inc.
Contact: Colin Boroski Rainier Communications 508-475-0025 x 142
Email Contact
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